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  • 8L Multilayer Circuit Board Assembly HDI High Tg 180 PCB Board with 3/3 Mil BGA Design and 30u" Hard Gold Plating
  • 8L Multilayer Circuit Board Assembly HDI High Tg 180 PCB Board with 3/3 Mil BGA Design and 30u" Hard Gold Plating
  • 8L Multilayer Circuit Board Assembly HDI High Tg 180 PCB Board with 3/3 Mil BGA Design and 30u" Hard Gold Plating
  • 8L Multilayer Circuit Board Assembly HDI High Tg 180 PCB Board with 3/3 Mil BGA Design and 30u" Hard Gold Plating
  • 8L Multilayer Circuit Board Assembly HDI High Tg 180 PCB Board with 3/3 Mil BGA Design and 30u" Hard Gold Plating
  • 8L Multilayer Circuit Board Assembly HDI High Tg 180 PCB Board with 3/3 Mil BGA Design and 30u" Hard Gold Plating
Structure: Multilayer Rigid PCB
Dielectric: FR-4
Material: Polyester Glass Fiber Mat Laminate
Application: Communication
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Customization:

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