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  • 8L Multilayer HDI High Tg 180 PCB with 3/3 Mil BGA and 30u" Hard Gold Plating Used for Industrial Control Panel
  • 8L Multilayer HDI High Tg 180 PCB with 3/3 Mil BGA and 30u" Hard Gold Plating Used for Industrial Control Panel
  • 8L Multilayer HDI High Tg 180 PCB with 3/3 Mil BGA and 30u" Hard Gold Plating Used for Industrial Control Panel
  • 8L Multilayer HDI High Tg 180 PCB with 3/3 Mil BGA and 30u" Hard Gold Plating Used for Industrial Control Panel
  • 8L Multilayer HDI High Tg 180 PCB with 3/3 Mil BGA and 30u" Hard Gold Plating Used for Industrial Control Panel
  • 8L Multilayer HDI High Tg 180 PCB with 3/3 Mil BGA and 30u" Hard Gold Plating Used for Industrial Control Panel
Type: Combining Rigid Circuit Board
Dielectric: FR-4
Material: Paper Phenolic Copper Foil Substrate
Application: Communication
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Customization:

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